CPU Cooling by Vapor Chamber with R-141b as Working Fluid
Keywords:Vapor chamber, electronics cooling, central processing unit
Air cooling and the space limitations are encountered problems of the thermal cooling electronic development for electronics devices or computer. In the present study, results of the experimental investigation on the thermal cooling of vapor chamber with refrigerant R-141b as working fluid for cooling computer processing unit of the personal computer are presented. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the thermal cooling are considered. Average CPU temperatures obtained from the vapor chamber cooling system with R-141b are 19.55%, 18.61% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 50% lower energy consumption for no load operating loads.
S.S. Hsieh, R.Y. Lee, J.C. Shyu, S.W. Chen, â€œAnalytical solution of thermal resistance of vapor chamber heat sink with and without pillarâ€, Energy Conversion and Management, Vol. 48, pp. 2708â€“2717, 2007.
S.S. Hsieh, R.Y. Lee, J.C. Shyu, S.W. Chen, â€œThermal performance of flat vapor chamber heat spreaderâ€, Energy Conversion and Management, Vol. 49, pp. 1774â€“1784, 2008.
X.L. Xie, Y.L. He, W.Q. Tao, H.W. Yang, â€œAn experimental investigation on a novel high-performance integrated heat pipeâ€“heat sink for high-flux chip coolingâ€, Applied Thermal Engineering, Vol. 28, pp. 433â€“439, 2008.
Y.W. Chang, C.H. Cheng, J.C. Wang, S.L. Chen, â€œHeat pipe for cooling of electronic equipmentâ€, Energy Conversion and Management, Vol. 49, pp. 3398â€“3404, 2008.
Y.S. Chen, K.H. Chien, T.C. Hung, C.C. Wang, Y.M. Ferng, B.S. Pei, â€œNumerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamberâ€, Applied Thermal Engineering, Vol. 29, pp. 2655â€“2664, 2009.
M. Zhang, Z. Liu, G. Ma, S. Cheng, â€œNumerical simulation and experimental verification of a flat two-phase thermosyphonsâ€, Energy Conversion and Management, Vol. 50, pp. 1095â€“1100, 2009.
L. Vasiliev, D. Lossouarn, C. Romestant, A. Alexandre, Y. Bertin, Y. Piatsiushyk, V. Romanenkov, â€œLoop heat pipe for cooling of high-power electronic componentsâ€, International Journal of Heat and Mass Transfer, Vol. 52, pp. 301â€“308, 2009.
Z. Ming, L. Zhongliang, M. Guoyuan, â€œThe experimental and numerical investigation of a grooved vapor chamberâ€, Applied Thermal Engineering, Vol. 29, pp. 422â€“430, 2009.
S.W. Kang, W.C. Wei, S.H. Tsai, C.C. Huang, â€œExperimental investigation of nanofluids on sintered heat pipe thermal performanceâ€, Applied Thermal Engineering, Vol. 29, pp. 973â€“979, 2009.
T.E. Tsai, H.H. Wu, C.C. Chang, S.L. Chen, â€œTwo-phase closed thermosyphon vapor-chamber system for electronic coolingâ€, International Communications in Heat and Mass Transfer, Vol. 37, pp. 484â€“489, 2010.
J.C. Wang, R.T. Wang, T.L. Chang, D.S. Hwang, â€œDevelopment of 30 Watt high-power LEDs vapor chamber-based plateâ€, International Journal of Heat and Mass Transfer, Vol. 53, pp. 3990â€“4001, 2010.
S.C. Wong, K.C. Hsieh, J.D. Wu, W.L. Han, â€œA novel vapor chamber and its performanceâ€, International Journal of Heat and Mass Transfer, Vol. 53, pp. 2377â€“2384, 2010.
T.H. Wang, C.C. Lee, Y.S. Lai, â€œThermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreaderâ€, Microelectronic Engineering, Vol. 87, pp. 2463â€“2467, 2010.
H.Y. Li, M.H. Chiang, C.I. Lee, W.J. Yang, â€œThermal performance of plate-fin vapor chamber heat sinksâ€, International Communications in Heat and Mass Transfer, Vol. 37, pp. 731â€“738, 2010.
H.Y. Li, M.H. Chiang, â€œEffects of shield on thermal-fluid performance of vapor chamber heat sinkâ€, International Journal of Heat and Mass Transfer, Vol. 54, pp. 1410â€“1419, 2011.
M. Reyes, D. Alonso, J.R. Arias, A. Velazquez, â€œExperimental and theoretical study of a vapour chamber based heat spreader for avionics applicationsâ€, Applied Thermal Engineering, Vol. 37, pp. 51-59, 2012.
A.A.A. Attia, B.T.A. El-Assal, â€œExperimental investigation of vapor chamber with different working fluids at different charge ratiosâ€, Ain Shams Engineering Journal, Vol. 2, pp. 289â€“297, 2012.
X. Ji, J. Xu, A.M. Abanda, â€œCopper foam based vapor chamber for high heat flux dissipationâ€, Experimental Thermal and Fluid Science, Vol. 40, pp. 93â€“102, 2012.
J. Choi, M. Jeong, J. Yoo, M. Seo, â€œA new CPU cooler design based on an active cooling heat sink combined with heat pipesâ€, Applied Thermal Engineering, Vol. 44, pp. 51-56, 2012.
P. Naphon, S. Wongwises, S. Wiriyasart, â€œOn the thermal cooling of central processing unit of the PCs with vapor chamberâ€, International Communications in Heat and Mass Transfer, Vol. 39, pp. 1165-1168, 2012.
P. Naphon, S. Wiriyasart, â€œStudy on the vapor chamber with refrigerant R-141b as working fluid for HDD coolingâ€, International Communications in Heat and Mass Transfer, 39, pp. 1449-1452, 2012.
P. Naphon, S. Wongwises, S. Wiriyasart, â€œApplication of two-phase vapor chamber technique for hard disk drive cooling of PCsâ€, International Communications in Heat and Mass Transfer, Vol. 40, pp. 32-35, 2013.
How to Cite
- Papers must be submitted on the understanding that they have not been published elsewhere (except in the form of an abstract or as part of a published lecture, review, or thesis) and are not currently under consideration by another journal published by any other publisher.
- It is also the authors responsibility to ensure that the articles emanating from a particular source are submitted with the necessary approval.
- The authors warrant that the paper is original and that he/she is the author of the paper, except for material that is clearly identified as to its original source, with permission notices from the copyright owners where required.
- The authors ensure that all the references carefully and they are accurate in the text as well as in the list of references (and vice versa).
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Attribution-NonCommercial 4.0 International that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
- The journal/publisher is not responsible for subsequent uses of the work. It is the author's responsibility to bring an infringement action if so desired by the author.