CPU Cooling by Vapor Chamber with R-141b as Working Fluid
Keywords:
Vapor chamber, electronics cooling, central processing unitAbstract
Air cooling and the space limitations are encountered problems of the thermal cooling electronic development for electronics devices or computer. In the present study, results of the experimental investigation on the thermal cooling of vapor chamber with refrigerant R-141b as working fluid for cooling computer processing unit of the personal computer are presented. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the thermal cooling are considered. Average CPU temperatures obtained from the vapor chamber cooling system with R-141b are 19.55%, 18.61% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 50% lower energy consumption for no load operating loads.
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