Effect of Electron Radiations on the Physical Properties of Laminated Particle Boards

Authors

  • Majid Hesami
  • Arun Gupta Associate Professor, Faculty of Chemical & Natural Resources Engineering, University Malaysia Pahang, Kuantan, Pahang, Malaysia
  • Jaafar Bin Abdullah
  • Mahrokh Avazpour

Keywords:

Melamine-Formaldehyde, Urea-Formaldehyde, Lamination, Coating

Abstract

In the present work, the particleboards laminated with melamine formaldehyde and Polymer Faced Chipboard(PFC) paper were radiated with different dosages of electron radiations and its impact on the polymerization  and other chemical properties were analyzed using characterization techniques such as TGA, DSC and XRD. It was observed that the amount of radiations have effect on the physical and thermal properties of the lamination. The knowledge from the present work will be used to develop new kind of coatings using melamine formaldehyde and PFC polymer and later on radiate it with the electron radiations to improve its thermal and mechanical properties.

 

Author Biography

Jaafar Bin Abdullah

Associate Professor

Director Centre for Biocomposites and Innovative Materials

FKKSA,  University Malaysia Pahang, Kuantan, Pahang, Malaysia, 26300

References

Weisshaar, T.A., Aeroelastic tailoring of forward swept composite wings. Journal of Aircraft, 1981. 18(8): p. 669-676.

Dunky, M., Urea–formaldehyde (UF) adhesive resins for wood. International Journal of Adhesion and Adhesives, 1998. 18(2): p. 95-107.

Cremonini, C. and A. Pizzi, Field weathering of plywood panels bonded with UF adhesives and low proportions of melamine salts. European Journal of Wood and Wood Products, 1999. 57(5): p. 318-318.

Marutzky, R., Release of formaldehyde by wood products. Wood adhesives-Chemistry and technology, 1989. 2: p. 307-387.

Cremonini, C., A. Pizzi, and C. Torro, Improved waterproofing of UF Plywood adhesives by melamine salts as glue-mix hardeners: System performance optimization. Holzforschung und Holzverwertung, 1997. 49: p. 11-15.

Ashter, S.A., Thermoforming of Single and Multilayer Laminates: Plastic Films Technologies, Testing, and Applications. 2013: William Andrew.

Youngquist, J.A., Wood-based composites and panel products. 1999.

Pizzi, A. and K.L. Mittal, Handbook of adhesive technology, revised and expanded. 2003: CRC Press.

Marutzky, R., Release of formaldehyde by wood products. Wood Adhesives—Chemistry and Technology, 1989. 2: p. 307-387.

Gupta,A, Patrick Jordan and Shusheng Pang ., Modelling the heat and mass transfer during hot pressing of medium density fiberboardâ€. Chemical Product and Process Modeling (2013). Volume 8, Issue 1, Pages 1–13, DOI: 10.1515/cppm-2013-0004,

Gupta, A., P.J. Jordan, and S.Pang,. Modelling of the development of the vertical density profile of MDF during hot pressing. Journal of Chemical Product and Process Modelling, Bepress. Vol-2 Art (1)

Kumar, A., Gupta, A., Sharma, K.V. and Nasir, M. Use of aluminum oxide nanoparticles in wood composites to enhance the heat transfer during hot-pressing. European Journal of Wood and Wood Products(2012) 71:193–198.

Kumar,A., Arun Gupta, K. V. Sharma, Mohammad Nasir, Tanveer Ahmad khan , Influence of activated charcoal as a filler on the properties of wood composite. International Journal of Adhesion and Adhesives 46(2013) 34-39.

Khan, T. A., Gupta, Arun., Jamari, S. S., Jose, R., Nasir, M., and Kumar, A., Synthesis and characterization of carbon fibers and their application in wood composites, BioRes. 8(3), 4171-4184.

Kumar,A., Arun Gupta and K. V. Sharma., Thermal and mechanical properties of urea formaldehyde (UF) resin combined with multiwalled carbon nanotubes (MWCNT) as nanofiller and fibreboards prepared by UF-MWCNT.Holzforchung,(2015)-69(2):199-205

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Published

2015-04-25

How to Cite

Hesami, M., Gupta, A., Abdullah, J. B., & Avazpour, M. (2015). Effect of Electron Radiations on the Physical Properties of Laminated Particle Boards. Asian Journal of Applied Sciences, 3(2). Retrieved from https://ajouronline.com/index.php/AJAS/article/view/2517

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Articles