Gomez, Frederick Ray I., STMicroelectronics, Inc., Philippines
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Asian Journal of Engineering and Technology Vol. 6 No. 6 (2018): December 2018 - Articles
Package Design Optimization with Reliability Test Verification for Reduction of Voids and Delamination
Abstract PDF -
Asian Journal of Engineering and Technology Vol. 6 No. 6 (2018): December 2018 - Articles
A Methodical Approach in Critical Processes Optimization of New Scalable Package Semiconductor Device for ESD Applications
Abstract PDF