Gomez, Frederick Ray I., and Rammil A. Seguido. “Package Design Optimization With Reliability Test Verification for Reduction of Voids and Delamination”. Asian Journal of Engineering and Technology 6, no. 6 (December 14, 2018). Accessed April 19, 2024. https://ajouronline.com/index.php/AJET/article/view/5604.