GOMEZ, F. R. I.; SEGUIDO, R. A. Package Design Optimization with Reliability Test Verification for Reduction of Voids and Delamination. Asian Journal of Engineering and Technology, [S. l.], v. 6, n. 6, 2018. DOI: 10.24203/ajet.v6i6.5604. Disponível em: https://ajouronline.com/index.php/AJET/article/view/5604. Acesso em: 26 apr. 2024.